WiWoTech has the capability to carry out EM simulation based Signal Integrity analysis, Power Integrity analysis, EMI/EMC analysis.
Signal Integrity analysis helps engineers to quickly and accurately analyze and eliminate signal integrity
and EMI/EMC design problems early in the design cycle. The interconnects operating at high frequency and fast switching
rates demand SI analysis for right design at first time. WiWO tech team has strong knowledge in SI theory and expertise in
simulation tools to analyse various SI issues like reflection due to impedance mismatch, crosstalk, signal attenuation and
PDN noise which affects the interconnect performance. SI analysis can be carried out at Pre layout as well as Post layout
phase and suggestions are provided for SI issues
Planning the stack-up for controlled impedance, dielectric material selection for high frequency operation, I/O buffer selection from
different drive strength, topology optimization, termination strategy, routing specifications (Trace width, spacing and length matching)
and floor planning for critical components are carried out in pre-layout analysis.
Simulation of routed board for potential SI issues like reflection, overshoot/undershoot, crosstalk, attenuation and EMI issues are carried
out in post-layout analysis.