What We Know

Wireless Module Design

  • Bluetooth
  • Bluetooth low energy
  • 802.15.4 / ZigBee
  • RFID
  • NFC
  • Wi-Fi (802.11 a/b/g/n)
  • WiMAX
  • 3G/4G
  • GPS

RF Circuit Design

  • Amplifiers
  • Low noise amplifiers
  • Power divider/combiner
  • Coupler
  • Filter
  • Balun
  • T/R Switch
  • Mixer
  • Frequency synthesizer
  • Diplexer/Duplexer

RF/Wireless System Design

  • 3G/4G Repeaters
  • BLE based Medical devices
  • GPS based tracking devices
  • Wi-Fi based phone system
  • Wi-Fi based Asset tracking system
  • Active/Passive RFID Tag and Reader
  • WiMAX CPE
  • Bluetooth based HID devices
  • RF Up/Down Converters
  • Transmit/Receive modules

RF simulations

  • Impedance matching
  • 50 ohm RF trace check
  • Link budget analysis
  • Cascaded RF front end analysis
  • Noise figure analysis
  • Circuit/Component design
  • System analysis
  • Gain/Loss analysis
  • EMI/EMC analysis
  • Parasitic extraction

Antenna design

  • Low profile wireless antenna
  • High gain antenna
  • Wide band antenna
  • MIMO antenna
  • Chip antenna
  • Phased array antenna
  • Array antenna
  • Multi band antenna
  • Base station antenna
  • Beam forming antenna
  • Diversity antenna
  • Active antenna

CAD based EM Simulations

WiWoTech can carry out the following EM CAD Tool based simulation based services for your designs
  • Signal integrity analysis
  • Power integrity analysis
  • EMI/EMC analysis
  • S-Parameter extraction
  • Link budget analysis
  • Wireless system analysis
  • Cross talk analysis
  • PCB board Stack up / Impedance analysis
  • RF Circuit design
  • Antenna design
  • RF Front end cascaded chain analysis
  • RF Propagation analysis

IC Package and SIP design

  • WiWoTech Systems Private Ltd has experienced engineers who have considerable experience in designing semiconductor packages
  • WiWoTech is capable of handling high density packages(BGA/LGA/CSP)
  • The following package technology can be handled by WiWo Tech
    • Single die, Multi die, Stacked die and SIP
    • FC-BGA,WB-BGA,CSP,FN,POP,LGA, Custom leaded and leadless Package
  • WiWo Tech is capable of supporting the following material technology
    • Organic,Polyimide,Rogers,LTCC,HTCC,FR4,Thick and Thin Film
  • WiWoTech offers IC/SIP package services,SI/PI/Thermal analysis and single window prototyping services to customers

PCB design

  • Single Layer to Up to 32 Layer PCB design
  • Rigid/Flex Substrate PCB design
  • PCB design to meet Regulatory reuirements
  • RF,Analog,Digital,Mixed Signal PCB design
  • Thermal enhanced PCB design
  • Impedance controlled PCB design

RF and antenna testing

  • RF Testing of Wireless Modules
  • RF testing of Wireless System
  • RF Tuning of circuits and systems
  • Far Field range antenna testing
  • FCC /ETSI regulatory testing
  • Radio Range Testing
  • RF Testing of Circuits
  • System validation testing of chips
  • Near field range antenna testing
  • Antenna tuning
  • EMI/EMC testing
  • Production Testing